• DocumentCode
    2508378
  • Title

    Thermal characterization of solar module due to impact of solar heat flux as an effect of geographical topology

  • Author

    Trifale, Ninad ; Kaisare, Abhijit ; Tonapi, Sandeep

  • Author_Institution
    Vishwakarma Inst. of Technol., Pune, India
  • fYear
    2012
  • fDate
    May 30 2012-June 1 2012
  • Firstpage
    1139
  • Lastpage
    1143
  • Abstract
    Currently just a thousandth of a part of the total solar flux reaching our planet is being used as an effective energy source. In the foreseeable future this use is expected to rise where reliability will be a major factor worth consideration during the design process. A steady state thermal analysis is carried out of a typical solar module assembly to study impact of solar heat flux as a function of time of day and geographic location. A three dimensional finite element model of a module that consists of silicon cells and bus bars sandwiched between glass cover and backsheet using an EVA and adhesive is solved numerically to predict the temperature variation of the solar module assembly. In the analysis the boundary conditions imposed with respect to variation of heat flux as a function of the day of year and geographical topology is applied to the module and temperature variations are evaluated. A parametric study is carried out to study effect of critical parameters such as intensity of solar flux and geographical location on the overall temperature distribution of the solar module assembly. The behavior is studied at selected major cities across the globe and the results are compared on the basis of particular season of the year (fall, spring etc.) and intensity of maximum temperatures observed. A general trend of variation of maximum temperature levels according to the geographical topology is established. Recommendations are provided to minimize the maximum junction temperature which eventually results in a productive design and installation of a solar module assembly.
  • Keywords
    busbars; finite element analysis; reliability; silicon; solar cells; temperature distribution; EVA; Si; adhesive; backsheet; bus bars; design process; energy source; geographic location; geographical topology; geographical topology effect; glass cover; maximum junction temperature; maximum temperature variation; reliability; silicon cells; solar flux; solar flux reaching; solar heat flux; solar module assembly; steady state thermal analysis; temperature distribution; thermal characterization; three dimensional finite element model; Assembly; Cities and towns; Continents; Finite element methods; Heating; Solar radiation; Temperature distribution; Geographical topology; Insolation; Solar Module; Temperature Distribution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
  • Conference_Location
    San Diego, CA
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-9533-7
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2012.6231551
  • Filename
    6231551