DocumentCode :
2508553
Title :
Equipment requirements for the repair of BGA-boards
Author :
Kergel, Helmut ; Monno, Bernd
Author_Institution :
VDI/VDE-Technologiezentrum Informationstech. GmbH, Teltow, Germany
fYear :
1996
fDate :
14-16 Oct 1996
Firstpage :
305
Lastpage :
311
Abstract :
During the production of high-value electronic boards it is often necessary to exchange BGAs within a repair process. The repair process generally is a manual process where the use of hot gas is common. FINETECH electronic GmbH of Berlin/Germany is developing and producing equipment for the assembly and the rework of PC-boards populated with high sophisticated ICs as well as flip chip devices. This equipment has to meet various requirements which is realized by having a modular concept. The base of the workstations is a patented vision alignment and placement principle which offers many advantages. Additionally, a new method to control the temperature of the hot gas was developed and introduced. Here the main patented idea is to control the temperature of the gas by mixing a hot and a cold gas stream instead of controlling the electrical power of a heating element for one single gas stream. Another key issue for a successful repair process is the design of the nozzles for the soldering and desoldering of the BGAs. All actual parameters of a specific repair or soldering cycle have to be protocolled and saved in order to reproduce each cycle at any time. Therefore, the human factor within a manual process is being suppressed to a minimum
Keywords :
maintenance engineering; packaging; printed circuit manufacture; BGA board; IC; PC board; assembly; desoldering; electronic board; equipment; flip chip device; hot gas; modular method; nozzle; placement; repair; rework; soldering; temperature control; vision alignment; workstation; Assembly; Chip scale packaging; Flip chip; Heating; Plastic packaging; Process design; Production; Soldering; Temperature control; Workstations;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1996., Nineteenth IEEE/CPMT
Conference_Location :
Austin, TX
ISSN :
1089-8190
Print_ISBN :
0-7803-3642-9
Type :
conf
DOI :
10.1109/IEMT.1996.559747
Filename :
559747
Link To Document :
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