• DocumentCode
    250885
  • Title

    Self-assembling sensors for printable machines

  • Author

    ByungHyun Shin ; Felton, Samuel M. ; Tolley, Michael T. ; Wood, Robert J.

  • Author_Institution
    Wyss Inst. for Biologically Inspired Eng., Harvard Univ., Cambridge, MA, USA
  • fYear
    2014
  • fDate
    May 31 2014-June 7 2014
  • Firstpage
    4417
  • Lastpage
    4422
  • Abstract
    Self-assembled structures and machines can be made using origami-inspired manufacturing methods. In particular, self-folding of two-dimensional materials using shape memory polymers and embedded electrical circuits has been utilized to build robots and structures in an inexpensive and rapid manner. In order to build increasingly complex and functional self-folding machines, however, methods for interaction with the environment are necessary. This paper presents and characterizes three types of self-folding sensors: a mechanical switch, a capacitive contact sensor, and a velocity sensor. We utilize specialized fold patterns to create cyclic mechanical linkages as well as additional composite layers such as magnetic sheets to build these sensors. We demonstrate the integration of two of these sensors, the switch and the contact sensor, into a lamp that can self-fold and immediately begin responding to its surroundings.
  • Keywords
    assembling; couplings; industrial robots; sensors; shape memory effects; velocity measurement; capacitive contact sensor; composite layers; cyclic mechanical linkages; embedded electrical circuits; functional self-folding machines; magnetic sheets; mechanical switch; origami-inspired manufacturing methods; printable machines; robots; self-assembled structures; self-assembling sensors; self-folding sensors; shape memory polymers; specialized fold patterns; two-dimensional materials; velocity sensor; Capacitance; Capacitive sensors; Contacts; Magnetic sensors; Voltage measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Robotics and Automation (ICRA), 2014 IEEE International Conference on
  • Conference_Location
    Hong Kong
  • Type

    conf

  • DOI
    10.1109/ICRA.2014.6907503
  • Filename
    6907503