• DocumentCode
    2508929
  • Title

    Enhanced heat transfer with jet impingement on structured-porous surfaces

  • Author

    Zhao, Zenghui ; Peles, Yoav ; Jensen, Michael K.

  • Author_Institution
    Center for Autom. Technol. & Syst., Rensselaer Polytech. Inst., Troy, NY, USA
  • fYear
    2012
  • fDate
    May 30 2012-June 1 2012
  • Firstpage
    1348
  • Lastpage
    1353
  • Abstract
    A new heat transfer method, which combines the merits of liquid jet impingement heat transfer with metallic porous surfaces, is proposed. The porous surface was made by sintering a single layer or multiple layers of copper wire mesh screen to a plain copper base heat transfer surface. Experiments were conducted with a 2.0-mm diameter circular water jet impinging onto a 6.35-mm diameter circular porous surface. The effects of jet subcooling, flow rates, and porous layer thickness on jet impingement heat transfer performance were explored under atmospheric pressure. The results show that increased subcooling improves heat transfer performance, and that flow rate has an insignificant effect on heat transfer performance when boiling is fully established. The effect of porous layer thickness depends on the specific working condition. With a four layer porous surface, a heat flux of 720 W/cm2 was reached at a wall superheat of 12.4 K.
  • Keywords
    atmospheric pressure; cooling; copper; flow through porous media; heat transfer; jets; sintering; atmospheric pressure; boiling; circular porous surface; circular water jet; copper wire mesh screen; enhanced heat transfer method; flow rates; heat flux; jet subcooling effect; liquid jet impingement heat transfer; metallic porous surfaces; plain copper base heat transfer surface; porous layer thickness effect; sintering; size 2.0 mm; size 6.35 mm; structured-porous surfaces; temperature 12.4 K; Copper; Heat transfer; Heating; Liquids; Surface treatment; Temperature measurement; Wires; boiling; heat flux; heat transfer coefficient porous; jet impingement; thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on
  • Conference_Location
    San Diego, CA
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-9533-7
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2012.6231577
  • Filename
    6231577