Title :
The manufacturing logistics of cofire ceramic electronic packages
Author :
Carr, Timothy W.
Author_Institution :
Alcoa Electron. Packaging Inc., San Diego, CA, USA
Abstract :
The manufacturing cycletime of cofire ceramic Pin Grid Array (PGA) electronic packages has been modeled using the principles of chemical kinetics. In this paper, the rates and mechanisms of chemical reactions are discussed in relation to the manufacturing cycletime. Alcoa Electronic Packaging has used this methodology to achieve world class status in the manufacturing of Pin Grid Array electronic packages
Keywords :
integrated circuit manufacture; integrated circuit packaging; production control; Alcoa Electronic Packaging; chemical kinetics model; cofire ceramic electronic packages; manufacturing cycletime; manufacturing logistics; pin grid array packages; Ceramics; Chemicals; Consumer electronics; Electronics packaging; Kinetic theory; Logistics; Manufacturing processes; Nickel; Pulp manufacturing; Virtual manufacturing;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1996., Nineteenth IEEE/CPMT
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-3642-9
DOI :
10.1109/IEMT.1996.559750
