• DocumentCode
    2509539
  • Title

    Practical performance/power alternatives within an existing CMOS technology generation

  • Author

    Bernstein, K. ; Bertsch, J.E. ; Clark, W.F.

  • Author_Institution
    IBM Microelectron., Essex Junction, VT
  • fYear
    1996
  • fDate
    12-14 Aug 1996
  • Firstpage
    365
  • Lastpage
    370
  • Abstract
    The tremendous demand for advanced microprocessors is making developers offer a superior product at a competitive price which meets specific performance, power, and reliability requirements. Today´s products are designed and built with essentially the same design, fabrication, and test tools used by all industry manufacturers and are constrained by the same device physics, package impedance, heat dissipation capability, and battery energy density limitations. In addition, the current technology generation presents a new set of difficult challenges for the treatment of power dissipation. Lowering voltage to reduce power diminishes FET overdrive and the performance of the device. Recapturing performance by migrating quickly to the next scaled technology generation, however, makes low-power designs expensive, and is not always necessary. Standard full scaling preserves physical and electrical relationships between parameters. On the other hand, selective scaling of specific device parameters may allow the exploitation of existing tools and designs by the use of a different design point on the process “surface”. This paper describes recent attempts to explore the feasibility of selective scaling and anticipated constraints associated with future technology generations
  • Keywords
    CMOS digital integrated circuits; VLSI; integrated circuit design; integrated circuit packaging; integrated circuit reliability; microprocessor chips; technological forecasting; CMOS technology generation; FET overdrive; battery energy density; design point; device physics; future technology; heat dissipation capability; low-power designs; microprocessors; package impedance; performance/power alternatives; power dissipation; reliability requirements; selective scaling; Batteries; Fabrication; Impedance; Manufacturing industries; Microprocessors; Packaging; Physics; Product design; Testing; Textile industry;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Low Power Electronics and Design, 1996., International Symposium on
  • Conference_Location
    Monterey, CA
  • Print_ISBN
    0-7803-3571-6
  • Type

    conf

  • DOI
    10.1109/LPE.1996.547540
  • Filename
    547540