DocumentCode
2510116
Title
The signal integrity simulation in the mobile phone design
Author
Wu, Feng
Author_Institution
Device Performance, Beijing, China
fYear
2010
fDate
12-16 April 2010
Firstpage
52
Lastpage
55
Abstract
In the mobile phone market, the challenge of time to market, small size, low cost becomes more and more obvious. Although there are more and more high speed signals with SI risk, yet it is still a must to reduce the development period and guarantee the SI performance with the low cost and small size solution. In this paper, the process and some key methods of the signal integrity (SI) simulation with the statistic analysis will be introduced. The target is to succeed in the first build.
Keywords
mobile handsets; statistical analysis; telecommunication network reliability; mobile phone design; signal integrity simulation; statistic analysis; Analytical models; Costs; Electromagnetic compatibility; Mobile handsets; Robustness; Routing; Signal design; Signal processing; Statistical analysis; Time to market;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on
Conference_Location
Beijing
Print_ISBN
978-1-4244-5621-5
Type
conf
DOI
10.1109/APEMC.2010.5475493
Filename
5475493
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