• DocumentCode
    2510116
  • Title

    The signal integrity simulation in the mobile phone design

  • Author

    Wu, Feng

  • Author_Institution
    Device Performance, Beijing, China
  • fYear
    2010
  • fDate
    12-16 April 2010
  • Firstpage
    52
  • Lastpage
    55
  • Abstract
    In the mobile phone market, the challenge of time to market, small size, low cost becomes more and more obvious. Although there are more and more high speed signals with SI risk, yet it is still a must to reduce the development period and guarantee the SI performance with the low cost and small size solution. In this paper, the process and some key methods of the signal integrity (SI) simulation with the statistic analysis will be introduced. The target is to succeed in the first build.
  • Keywords
    mobile handsets; statistical analysis; telecommunication network reliability; mobile phone design; signal integrity simulation; statistic analysis; Analytical models; Costs; Electromagnetic compatibility; Mobile handsets; Robustness; Routing; Signal design; Signal processing; Statistical analysis; Time to market;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-5621-5
  • Type

    conf

  • DOI
    10.1109/APEMC.2010.5475493
  • Filename
    5475493