DocumentCode :
2510116
Title :
The signal integrity simulation in the mobile phone design
Author :
Wu, Feng
Author_Institution :
Device Performance, Beijing, China
fYear :
2010
fDate :
12-16 April 2010
Firstpage :
52
Lastpage :
55
Abstract :
In the mobile phone market, the challenge of time to market, small size, low cost becomes more and more obvious. Although there are more and more high speed signals with SI risk, yet it is still a must to reduce the development period and guarantee the SI performance with the low cost and small size solution. In this paper, the process and some key methods of the signal integrity (SI) simulation with the statistic analysis will be introduced. The target is to succeed in the first build.
Keywords :
mobile handsets; statistical analysis; telecommunication network reliability; mobile phone design; signal integrity simulation; statistic analysis; Analytical models; Costs; Electromagnetic compatibility; Mobile handsets; Robustness; Routing; Signal design; Signal processing; Statistical analysis; Time to market;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-5621-5
Type :
conf
DOI :
10.1109/APEMC.2010.5475493
Filename :
5475493
Link To Document :
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