DocumentCode
2510506
Title
Factors influencing the successful validation of transient phenomenon modelling
Author
Telleria, Ricardo Jauregui ; Silva, Ferran ; Orlandi, Antonio ; Sasse, Hugh ; Duffy, Alistair
Author_Institution
Univ. Politec. de Catalunya, Barcelona, Spain
fYear
2010
fDate
12-16 April 2010
Firstpage
338
Lastpage
341
Abstract
An increased requirement for validation of computational electromagnetic simulation and modelling through the publication of IEEE Standard 1597.1 brings to light some interesting issues surrounding the validation of transients. The structure of a transient event has three particular regions of interest that can have an influence on the results, of which only two are generally well defined. These are the initial quiescent phase from t = 0 to the transient event; the transient event itself up to the point where the energy has fallen to a predefined limit, and the post-transient phase where residual energy is still present in the system. This latter region is generally ill-defined and changes the way that a validation comparison should be made, from, for example a frequency domain coupling study where the region of interest is usually well defined. This study looks at the influence of the three regions on the validation results and suggests how the Feature Selective Validation (FSV) method can be applied in transient studies.
Keywords
IEEE standards; computational electromagnetics; electromagnetic interference; frequency-domain analysis; transient analysis; IEEE Standard 1597.1; computational electromagnetic simulation; feature selective validation; frequency domain coupling; residual energy; transient phenomenon modelling; Computational modeling; Digital communication; Digital systems; Electromagnetic compatibility; Electromagnetic modeling; Electromagnetic transients; Frequency domain analysis; Immunity testing; Phase measurement; Time measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on
Conference_Location
Beijing
Print_ISBN
978-1-4244-5621-5
Type
conf
DOI
10.1109/APEMC.2010.5475513
Filename
5475513
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