Title :
Design And Characterization Of A Novel Fiber Optic Coupling Device For Data Communication Applications
Author :
Heiney, A.J. ; Jiang, C.-L. ; Reysen, W.H.
Author_Institution :
AMP Incorporated
Keywords :
Assembly; Bonding; Costs; Data communication; Integrated circuit packaging; Lenses; Optical coupling; Optical design; Optical fiber devices; Optical fibers;
Conference_Titel :
Optical Microwave Interactions/Visible Semiconductor Lasers/Impact of Fiber Nonlinearities on Lightwave Systems/Hybrid Optoelectronic Integration and Packaging/Gigabit Networks., LEOS 1993 Summer Topi
Conference_Location :
Santa Barbara, CA, USA
Print_ISBN :
0-7803-1284-8
DOI :
10.1109/LEOSST.1993.696869
