Title :
Quantitative model for thermal behaviour of an analog integrated circuit
Author :
Sandha, Gagandeep S. ; Singh, Pawan K. ; Kumar, C. Pradeep ; Nagchoudhuri, D.
Author_Institution :
PEC, Chandigarh, India
Abstract :
Localized heating of different areas of an integrated circuit lead to the temperature variations across the various regions. The thermal gradients flow across the semiconductor chip causing the circuit to behave in an abnormal way. This paper introduces a mathematical model to determine the change in the integrated circuit output parameters due to non-linearity in operation of the high heat dissipating devices the in the chip and the flow of thermal gradients.
Keywords :
analogue integrated circuits; high-temperature electronics; semiconductor device models; semiconductor devices; analog integrated circuit; high heat dissipating devices; mathematical model; quantitative model; semiconductor chip; temperature variations; thermal behaviour; thermal gradients flow; Analog integrated circuits; Analytical models; Bipolar integrated circuits; Heating; Integrated circuit modeling; MOS devices; Numerical models; Photonic band gap; Temperature sensors; Threshold voltage;
Conference_Titel :
VLSI Design, 2004. Proceedings. 17th International Conference on
Print_ISBN :
0-7695-2072-3
DOI :
10.1109/ICVD.2004.1260988
