Junction-to-case thermal resistance-still a myth?

Author

Dutta, Vivek B.

Author_Institution

Nat. Semicond. Corp., Santa Clara, CA, USA

fYear

1988

fDate

10-12 Feb 1988

Firstpage

8

Lastpage

11

Abstract

After a brief review of MIL-STD-883C: Method 102 and SEMI Std. Doc. #1321 for junction-to-case thermal resistance (θ_JC) measurements, an experiment to measure θ _JC of different K packages while altering the extrinsic variables is described. It is concluded that junction-to-case thermal resistance is not a physical constant: measurement conditions have a significant influence on this data. Thus, in order to make use of θ_JC data, it should be accompanied by measurement conditions, such as die size, power, and environment (type and intensity). These measurement conditions, all within the Standard´s guideline, are discussed and recommendations for proper presentation and use of the information are emphasized

Keywords

measurement standards; military systems; thermal resistance measurement; MIL-STD-883C; die size; environment; junction-to-case thermal resistance; measurement conditions; measurement standards; military standards; power; Ceramics; Electrical resistance measurement; Electronic packaging thermal management; Measurement standards; Power measurement; Semiconductor device packaging; Temperature; Thermal management; Thermal resistance; Thermal variables measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal and Temperature Measurement Symposium, 1988. SEMI-THERM IV., Fourth Annual IEEE

Conference_Location

San Diego, CA

Type

conf

DOI

10.1109/SEMTHE.1988.10590

Filename

10590