Title :
Optical And Package Design Issues For Chip-to-chip Free-space Optical Interconnections
Author_Institution :
AT&T Bell Laboratories
Keywords :
High speed optical techniques; Lenses; Optical arrays; Optical design; Optical devices; Optical interconnections; Optical receivers; Optical sensors; Optical transmitters; Packaging;
Conference_Titel :
Optical Microwave Interactions/Visible Semiconductor Lasers/Impact of Fiber Nonlinearities on Lightwave Systems/Hybrid Optoelectronic Integration and Packaging/Gigabit Networks., LEOS 1993 Summer Topi
Conference_Location :
Santa Barbara, CA, USA
Print_ISBN :
0-7803-1284-8
DOI :
10.1109/LEOSST.1993.696873