Title :
Compact LTCC module for WLAN RF front-end
Author :
Zhu, Li-Zheng ; Wei, Xu-Bo ; Wang, Peng ; Ma, Song ; Zeng, Zhi-Yi ; Yang, Bang-Chao
Author_Institution :
Res. Inst. of Electron. Sci. & Technol., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
Abstract :
In this paper, a low-temperature co-fired ceramic (LTCC) module for Wireless Local Area Network (WLAN) RF front-end is proposed. The module integrates an embedded band pass filter, an embedded lumped element Wilkinson power divider, and embedded LTCC inductors and capacitors, in a single LTCC package. The circuit is separated into low-frequency circuit part and high frequency circuit part. By integrating these miniature passive component designs, using the three-dimensional multichip module multichip module (3D-MCM) technique, the proposed module features a compact size of 20mm×20mm×5mm. The measurement results show that the application meets the current electrical specification requirements of the wireless communication system compatible with IEEE802.11b/g.
Keywords :
band-pass filters; ceramic packaging; power dividers; wireless LAN; 3D-MCM technique; LTCC capacitor; LTCC inductor; LTCC package; WLAN RF front-end; band pass filter; compact LTCC module; low-temperature cofired ceramic; lumped element Wilkinson power divider; miniature passive component design; three-dimensional multichip module multichip module; wireless local area network; Band pass filters; Inductors; Microwave amplifiers; Power amplifiers; Power dividers; Substrates; Wireless LAN;
Conference_Titel :
Computational Problem-Solving (ICCP), 2011 International Conference on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4577-0602-8
Electronic_ISBN :
978-1-4577-0601-1
DOI :
10.1109/ICCPS.2011.6092238