Title :
Analyses of high speed interconnects using a non-conformal domain decomposition method
Author :
Peng, Zhen ; Shao, Yang ; Lee, Jin-Fa
Author_Institution :
Electro Sci. Lab., Ohio State Univ., Columbus, OH, USA
Abstract :
An efficient non-conformal domain decomposition method (DDM) is proposed to investigate signal integrity (SI) of high-speed interconnections on multi-layer printed circuit board (PCB) in this paper.
Keywords :
integrated circuit interconnections; printed circuits; high speed interconnects; multilayer printed circuit board; nonconformal domain decomposition; signal integrity; Distributed decision making; Electromagnetic analysis; Electromagnetic compatibility; Integrated circuit interconnections; Matrix decomposition; Maxwell equations; Packaging; Signal analysis; Sparse matrices; Transmission line matrix methods;
Conference_Titel :
Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-5621-5
DOI :
10.1109/APEMC.2010.5475545
