DocumentCode :
2511399
Title :
Analysis of mobile phone´s immunity to electrostatic discharge soft failures
Author :
Kwon, Soon Jae ; Kim, Ki Hyuk ; Yongsup Kim ; Kim, Austin S.
Author_Institution :
Adv. CAE Lab., Samsung Electron. Co., Ltd., Suwon, South Korea
fYear :
2010
fDate :
12-16 April 2010
Firstpage :
68
Lastpage :
71
Abstract :
A technique for the analysis of mobile phone´s immunity to the electrostatic discharge (ESD) soft failures is proposed. First, a mobile phone, ESD simulator and ESD testing setup are modelled and then the simulation is performed using time-domain full-wave electromagnetic simulator. The proposed technique is applied to the analysis of ESD soft failure of mobile phones and the root causes of the ESD soft failure are investigated. ESD voltages obtained from simulation are compared to that from measurement. Also, improvement in the frequency of occurrence of ESD soft failure by the application of countermeasures derived from ESD simulation result is presented.
Keywords :
electrostatic discharge; failure analysis; immunity testing; mobile handsets; time-domain analysis; ESD simulator; ESD testing setup; ESD voltage; electrostatic discharge soft failure; mobile phone; time-domain full-wave electromagnetic simulator; Electromagnetic measurements; Electromagnetic modeling; Electrostatic analysis; Electrostatic discharge; Failure analysis; Mobile handsets; Performance evaluation; Testing; Time domain analysis; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-5621-5
Type :
conf
DOI :
10.1109/APEMC.2010.5475557
Filename :
5475557
Link To Document :
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