DocumentCode :
2511508
Title :
Inclusion of thermal effects in the simulation of bipolar circuits using circuit level behavioral modeling
Author :
Shelar, Tushar S. ; Visweswaran, G.S.
Author_Institution :
Agere Syst. India Pvt. Ltd., Bangalore, India
fYear :
2004
fDate :
2004
Firstpage :
821
Lastpage :
826
Abstract :
In this paper, a portable subcircuit for BJT is developed that incorporates self heating as well as thermal coupling effects. Our approach is to use built-in controlled sources in the simulator to model inter dependent thermal as well as electrical behavior. The great advantage of this model is the portability to a large number of general purpose electronic circuit simulators. It also eliminate need for separate thermal simulator and/or need to modify any model equation. Thermal parameters are modeled using thermal-electrical analogy. Finite difference approach is used to model the thermal grid network. This facilitates simultaneous and accurate thermal as well as electrical simulation. BJT Current mirror circuit is simulated to show the significance of the model. For discrete BJT current mirror, standard circuit simulation produces error up to 84% versus 3.8% for our model when compared to experimental results. The results obtained for integrated circuit current mirror shows the utility of electrothermal model for simulation of BJT integrated circuits where thermal coupling effect plays important role.
Keywords :
bipolar transistors; circuit simulation; integrated circuits; semiconductor device models; BJT circuit current mirror; bipolar circuits; bipolar junction transistor; built in controlled sources; circuit level behavioral modeling; circuit simulation; general purpose electronic circuit simulators; integrated circuit current mirror; self heating; thermal coupling effects; thermal effects; thermal grid network; thermal-electrical analogy; Bipolar transistor circuits; Circuit simulation; Coupling circuits; Electronic packaging thermal management; Electrothermal effects; Equations; Heating; Integrated circuit modeling; Mirrors; Temperature sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Design, 2004. Proceedings. 17th International Conference on
Print_ISBN :
0-7695-2072-3
Type :
conf
DOI :
10.1109/ICVD.2004.1261033
Filename :
1261033
Link To Document :
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