Introduction to conductive adhesive film technology

Author

Wei De Liu ; Li, Ze Ming ; Ling, Song Wen ; Zhang, Wen Jie ; Wu, Chi Kwan

Author_Institution

3M China R&D Center, 3M China Ltd., Shanghai, China

fYear

2010

fDate

12-16 April 2010

Firstpage

1664

Lastpage

1667

Abstract

The paper describes typical structures of conductive adhesives and anisotropic conductive adhesive film. A tailored conductive particle with optimum loading is important to a good-performance adhesive. The paper also discuss typical applications in electronic devices for solving electrical connection issue, ESD grounding issue, EMI shielding issue and particular for anisotropic conductive adhesive´s special application for flex bonding, chip bonding to PCB or glass surface. The diversity of conductive adhesives provides many effective solutions to solve design or assembly issues.

Keywords

conductive adhesives; earthing; electromagnetic interference; electromagnetic shielding; electrostatic discharge; printed circuits; EMI shielding; ESD grounding; PCB; anisotropic conductive adhesive film; chip bonding; electrical connection; electronic devices; flex bonding; glass surface; optimum loading; Anisotropic conductive films; Anisotropic magnetoresistance; Assembly; Bonding; Conductive adhesives; Conductive films; Electromagnetic interference; Electrostatic discharge; Glass; Grounding;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on

Conference_Location

Beijing

Print_ISBN

978-1-4244-5621-5

Type

conf

DOI

10.1109/APEMC.2010.5475583

Filename

5475583