Designing with thermal impedance

Author

Hopkins, T. ; Cognetti, C. ; Tiziani, R.

Author_Institution

SGS-Thomson Microelectron., Phoenix, AZ, USA

fYear

1988

fDate

10-12 Feb 1988

Firstpage

55

Lastpage

61

Abstract

Thermal impedance and the main factors influencing it in plastic semiconductor packages are discussed. A test procedure is presented for measuring and quantifying the thermal characteristics of semiconductor packages. Using these test methods the thermal impedance of standard integrated circuit packages under pulsed and DC conditions were evaluated. Experimental evaluations of the thermal performance of small signal, medium-power, and high-power dual in-line (DIP) and multiwatt packages are presented as case examples. The effects of the thermal capacitance of the packages when dealing with low duty-cycle power dissipation are presented and evaluated in each of the example cases

Keywords

characteristics measurement; integrated circuit testing; packaging; thermal variables measurement; DC; dual in-line; low duty-cycle power dissipation; multiwatt packages; plastic semiconductor packages; pulse supply; standard integrated circuit packages; thermal capacitance; thermal characteristics; thermal impedance; Circuit testing; Impedance; Integrated circuit measurements; Integrated circuit packaging; Integrated circuit testing; Plastic integrated circuit packaging; Plastic packaging; Semiconductor device packaging; Semiconductor device testing; Thermal factors;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal and Temperature Measurement Symposium, 1988. SEMI-THERM IV., Fourth Annual IEEE

Conference_Location

San Diego, CA

Type

conf

DOI

10.1109/SEMTHE.1988.10597

Filename

10597