• DocumentCode
    2512131
  • Title

    Correlation of measurement and simulation for simultaneous switching noise of FPGA

  • Author

    Takahashi, Yo ; Yamamoto, Yuki ; Sudo, Toshio ; Ota, Kunio ; Matsuge, Kazuhisa

  • Author_Institution
    Shibaura Inst. of Technol., Tokyo, Japan
  • fYear
    2010
  • fDate
    12-16 April 2010
  • Firstpage
    350
  • Lastpage
    353
  • Abstract
    FPGAs (Field Programmable Gate Array) are now widely used for prototyping systems as well as mid-volume products. These FPGAs are fabricated by the leading edge CMOS process technology. These may excite false logic transition due to simultaneous switching CMOS output buffers. In this paper, simultaneous switching noise of FPGA was investigated by both measurement and simulation. First, a precise circuit model was established by extracting the leadframe inductance of the package and including on-chip decoupling capacitance. The power supply impedance of an evaluation board was also simulated. Then, measured waveforms were compared with time-domain simulated results. The simulated time-domain waveforms showed a good agreement with measured waveforms. Moreover, ringing frequency of the measured waveforms was well correlated with the peak of the power supply impedance.
  • Keywords
    CMOS logic circuits; buffer circuits; circuit noise; circuit simulation; electronics packaging; field programmable gate arrays; CMOS process technology; FPGA; evaluation board; field programmable gate array; leadframe inductance extraction; on-chip decoupling capacitance; power supply impedance; ringing frequency; simulated time-domain waveforms; simultaneous switching CMOS output buffers; simultaneous switching noise simulation; CMOS process; CMOS technology; Circuit simulation; Field programmable gate arrays; Impedance; Noise measurement; Power supplies; Programmable logic arrays; Prototypes; Time domain analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-5621-5
  • Type

    conf

  • DOI
    10.1109/APEMC.2010.5475591
  • Filename
    5475591