SPICE-model of multiwall carbon nanotube through-hole vias

Author

D´Amore, Marcello ; Sarto, Maria Sabrina ; Tamburrano, Alessio

Author_Institution

Dept. of Electr. Eng., Sapienza Univ. of Rome, Rome, Italy

fYear

2010

fDate

12-16 April 2010

Firstpage

1104

Lastpage

1107

Abstract

Through-hole vias made of multiwall carbon nanotubes (MWCNTs) are simulated using the multiconductor and equivalent single conductor models. The circuit approach is developed in order to define an equivalent lumped-parameter SPICE-model. Different expressions of the p.u.l. damping quantum resistance are considered and their impact on the prediction of the via performance at high frequency is discussed. The frequency spectra of the input impedance and of the current transfer function of nano-vias with different length are computed in the frequency range up to 100 GHz.

Keywords

SPICE; carbon nanotubes; electric impedance; lumped parameter networks; multiconductor transmission lines; nanoelectronics; transfer functions; current transfer function; damping quantum resistance; equivalent single conductor model; frequency spectra; input impedance; lumped-parameter SPICE-model; multiconductor model; multiwall carbon nanotube; nano-vias; through-hole vias; Carbon nanotubes; Circuit simulation; Conductors; Copper; Electromagnetic compatibility; Frequency; Integrated circuit interconnections; Multiconductor transmission lines; Nanotechnology; Thermal conductivity; SPICE model; Through-hole via; equivalent single conductor; multiwall carbon nanotube; transmission line;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on

Conference_Location

Beijing

Print_ISBN

978-1-4244-5621-5

Type

conf

DOI

10.1109/APEMC.2010.5475597

Filename

5475597