Title :
SPICE-model of multiwall carbon nanotube through-hole vias
Author :
D´Amore, Marcello ; Sarto, Maria Sabrina ; Tamburrano, Alessio
Author_Institution :
Dept. of Electr. Eng., Sapienza Univ. of Rome, Rome, Italy
Abstract :
Through-hole vias made of multiwall carbon nanotubes (MWCNTs) are simulated using the multiconductor and equivalent single conductor models. The circuit approach is developed in order to define an equivalent lumped-parameter SPICE-model. Different expressions of the p.u.l. damping quantum resistance are considered and their impact on the prediction of the via performance at high frequency is discussed. The frequency spectra of the input impedance and of the current transfer function of nano-vias with different length are computed in the frequency range up to 100 GHz.
Keywords :
SPICE; carbon nanotubes; electric impedance; lumped parameter networks; multiconductor transmission lines; nanoelectronics; transfer functions; current transfer function; damping quantum resistance; equivalent single conductor model; frequency spectra; input impedance; lumped-parameter SPICE-model; multiconductor model; multiwall carbon nanotube; nano-vias; through-hole vias; Carbon nanotubes; Circuit simulation; Conductors; Copper; Electromagnetic compatibility; Frequency; Integrated circuit interconnections; Multiconductor transmission lines; Nanotechnology; Thermal conductivity; SPICE model; Through-hole via; equivalent single conductor; multiwall carbon nanotube; transmission line;
Conference_Titel :
Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-5621-5
DOI :
10.1109/APEMC.2010.5475597
