• DocumentCode
    2512341
  • Title

    PCS-photoformed conductors on ceramic substrates

  • Author

    Pfeiffer, Th ; Dudek, D.

  • Author_Institution
    du Pont de Nemours GmbH, Neu-Isenburg, West Germany
  • fYear
    1988
  • fDate
    9-11 May 1988
  • Firstpage
    322
  • Lastpage
    325
  • Abstract
    PCS, a system for the formation of high-definition metal powder images that are transformed into the corresponding conductive patterns by firing, is described with particular reference to gold conductors. The PCS process consists of coating precleaned alumina substrates with a thin, amorphous layer of a mixture of nitrophenyl dihydropyridine derivatives, exposing this layer through a mask to UV light thereby changing the exposed material into a tacky state, toning the exposed areas, and firing the toned substrate by a conventional thick-film method. The PCS process creates high resolution conductors, up to 25-microns-resolution line/space with an excellent edge definition of ±3 microns, which can be fired several times. The sheet resistivity, which depends on the toner materials used, can be adjusted in the range of 10-20 m Ω/square at fired thicknesses in the range of 3-5 microns. Bondability is comparable to that of conventional thick film gold pastes with pull forces higher than 10 cN for 37.5-micron gold wire. Compatibility with dielectric and resistor pastes as well as with light-sensitive dielectric thick-film materials is shown
  • Keywords
    aluminium compounds; ceramics; gold; substrates; thick film circuits; 25 micron; 3 to 5 micron; Al2O3 substrates; Au conductors; PCS process; UV photolithography; conductive patterns; excellent edge definition; fired thicknesses; firing; high resolution conductors; high-definition metal powder images; materials compatibility; photoformed conductors on ceramic substrates; pull forces; sheet resistivity; thick-film circuits; thick-film materials; wire bondability; Ceramics; Conducting materials; Conductors; Dielectric materials; Firing; Gold; Personal communication networks; Powders; Sheet materials; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Components Conference, 1988., Proceedings of the 38th
  • Conference_Location
    Los Angeles, CA
  • Type

    conf

  • DOI
    10.1109/ECC.1988.12611
  • Filename
    12611