• DocumentCode
    2512437
  • Title

    Stopband characteristics of planar-type electromagnetic bandgap structure with ferrite film

  • Author

    Toyota, Yoshitaka ; Kondo, Koichi ; Yoshida, Shigeyoshi ; Iokibe, Kengo ; Koga, R.

  • Author_Institution
    Dept. of Commun. Network Eng., Okayama Univ., Okayama, Japan
  • fYear
    2010
  • fDate
    12-16 April 2010
  • Firstpage
    664
  • Lastpage
    667
  • Abstract
    The noise suppression effect after interposing a ferrite film of several microns in thickness between the power and ground planes is discussed in this paper. In particular, we focused on the combination of a planar electromagnetic bandgap structure with a ferrite film deposited by using spin spray ferrite plating at a low temperature. In this paper, the stopband characteristics are discussed through the use of both simulation and measurement results. First, a full-wave electromagnetic simulation revealed that a test board with a dielectric as thin as a few hundreds of microns has the stopband characteristics of the frequency shift towards the lower frequencies (miniaturization effect) and stopband expansion with the removal of the passband, which was not observed in the case of a thick-dielectric test board. The simulation results also demonstrated that these improvements mainly resulted from the complex permeability of the ferrite film. Next, we found that the measurements are very similar to the simulation results.
  • Keywords
    cryogenics; ferrites; printed circuit testing; thin films; ferrite film; full-wave electromagnetic simulation; ground planes; noise suppression effect; permeability; planar-type electromagnetic bandgap structure; power planes; printed circuit board; spin spray ferrite plating; stopband characteristics; thick-dielectric test board; Dielectric measurements; Electromagnetic measurements; Ferrite films; Frequency; Land surface temperature; Passband; Periodic structures; Permeability; Spraying; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-5621-5
  • Type

    conf

  • DOI
    10.1109/APEMC.2010.5475608
  • Filename
    5475608