Title :
Parallelization Methods for Implementation of Discharge Simulation along Resin Insulator Surfaces
Author :
Tan, Tianfang ; Li, Kenli ; Tang, Zhuo ; Wang, Feng
Author_Institution :
Sch. of Comput. & Commun., Hunan Univ., Changsha, China
Abstract :
Three parallelization approaches used in the program of discharge simulation along resin insulator surfaces in SF6/N2 gas mixture which initially consumes a great deal of computational time and suitable for implementation on computer systems with symmetric multiprocessor (SMP) architecture are developed and validated in this paper. The approaches include: (i) static domain decomposition using a distributed memory approach, (ii) particle decomposition using a distributed memory approach, (iii) hybrid dynamic domain decomposition and particle decomposition using multilevel distributed and shared memory approaches respectively. All three methods were implemented and tested on an IBM supercomputer system and finally achieved the goal of reducing execution time to a certain extent. Results show that the multi-lever hybrid approach provides an effective parallelization method than method (i) and method (ii) owing to its load balance considering, even arising additional computational time for dynamic domain decomposition.
Keywords :
SF6 insulation; electrical engineering computing; gas mixtures; insulators; multiprocessing systems; parallel algorithms; resins; IBM supercomputer system; SF6-N2; computer systems; discharge simulation; distributed memory approach; dynamic domain decomposition; gas mixture; multilevel distributed memory approach; multilever hybrid approach; parallelization method; particle decomposition; resin insulator surfaces; shared memory approach; static domain decomposition; symmetric multiprocessor architecture; Computational modeling; Computer simulation; Concurrent computing; Dielectrics and electrical insulation; Embedded computing; Gas insulation; Plasma simulation; Resins; Sulfur hexafluoride; Surface discharges; discharge simulation; domain decomposition; particle decomposition;
Conference_Titel :
Scalable Computing and Communications; Eighth International Conference on Embedded Computing, 2009. SCALCOM-EMBEDDEDCOM'09. International Conference on
Conference_Location :
Dalian
Print_ISBN :
978-0-7695-3825-9
DOI :
10.1109/EmbeddedCom-ScalCom.2009.79