Title :
Chip-scale DC/DC power converter
Author :
Shenai, Krishna ; Bernstein, Gary H. ; Xing, Huili Grace ; Wu, Jie
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Toledo, Toledo, OH, USA
Abstract :
The design of disruptive chip-scale integration of DC/DC power converters using breakthrough silicon and GaN power semiconductor switching devices, silicon CMOS control IC, MEMS inductor and microchip supercapacitor assembled using novel “Quilt Packaging” and microcooling to achieve nearly 90% power conversion efficiency is reported.
Keywords :
CMOS integrated circuits; DC-DC power convertors; III-V semiconductors; chip scale packaging; elemental semiconductors; gallium compounds; inductors; micromechanical devices; power semiconductor switches; silicon; supercapacitors; wide band gap semiconductors; GaN; GaN power semiconductor switching device; MEMS inductor; chip-scale DC-DC power converter; chip-scale integration; microchip supercapacitor; microcooling; quilt packaging; silicon; silicon CMOS control IC; Capacitors; Converters; Gallium nitride; Inductors; Logic gates; Silicon; Substrates; DC-to-DC Converter; GaN FET; Quilt Packaging; integrated inductor; microcooler;
Conference_Titel :
Aerospace and Electronics Conference (NAECON), Proceedings of the IEEE 2010 National
Conference_Location :
Fairborn, OH
Print_ISBN :
978-1-4244-6576-7
DOI :
10.1109/NAECON.2010.5712969
