Title :
A finite element thermal analysis program for square shaped packages and subsequent experimental comparisons
Author_Institution :
Honeywell Inc., Phoenix, AZ, USA
Abstract :
A finite-element thermal analysis program is presented. A description of the finite element used in the program is provided along with an explanation of the matrix storage scheme and simultaneous equation solution which significantly reduces memory requirements. A specific model of a real package is given along with a discussion of the development of realistic convection boundary conditions. A comparison with subsequent experimental results shows that this simple-to-use program, which can run on a personal computer, can predict junction-to-air resistances within 10% of the measured value
Keywords :
convection; cooling; electronic engineering computing; finite element analysis; heat sinks; matrix algebra; packaging; convection boundary conditions; electronic engineering computing; finite element thermal analysis; junction-to-air resistances; matrix storage; personal computer; simultaneous equation solution; square shaped packages; Bandwidth; Boundary conditions; Electrical resistance measurement; Equations; Finite element methods; Microcomputers; Packaging; Predictive models; Shape; Temperature;
Conference_Titel :
Semiconductor Thermal and Temperature Measurement Symposium, 1988. SEMI-THERM IV., Fourth Annual IEEE
Conference_Location :
San Diego, CA
DOI :
10.1109/SEMTHE.1988.10608
