PWB thermal modeling computer tools at Texas Instruments

Author

West, S.E. ; Pylant, J.K.

Author_Institution

Texas Instrum. Inc., Lewisville, TX, USA

fYear

1988

fDate

10-12 Feb 1988

Firstpage

105

Lastpage

111

Abstract

Printed wiring board (PWB) thermal modeling tools developed at Texas Instruments are described. These general programs help automate the processes of: finite-difference-model generation for PWBs and other rectangular, layered structures; definition of heat inputs to a thermal model of a PWB due to electronic components; and calculation of component junction temperatures for devices located on a modeled PWB. The features of the programs are described and their usefulness in the design environment is explained. The direction of current and anticipated future development is addressed

Keywords

Texas Instruments computers; circuit layout CAD; difference equations; digital simulation; heat sinks; microcomputer applications; printed circuits; CAD; PWB; Texas Instruments; component junction temperatures; finite-difference-model generation; rectangular layered structure; thermal modeling computer tools; DC generators; Environmental management; Finite difference methods; Instruments; Programming; Reliability; Surface resistance; Temperature dependence; Thermal management of electronics; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal and Temperature Measurement Symposium, 1988. SEMI-THERM IV., Fourth Annual IEEE

Conference_Location

San Diego, CA

Type

conf

DOI

10.1109/SEMTHE.1988.10609

Filename

10609