DocumentCode :
2512704
Title :
High-resolution self-consistent thermal modelling of multi-gate power GaAs MESFETs
Author :
Ghione, G. ; Naldi, C.U.
Author_Institution :
Dipartimento di Elettronica, Politecnico di Milano, Italy
fYear :
1989
fDate :
3-6 Dec. 1989
Firstpage :
147
Lastpage :
150
Abstract :
A DC and small-signal self-consistent thermal physical model for power GaAs MESFETs is presented. The high-resolution coupled electrothermal two-dimensional simulation is carried out on the active region only, while the large-scale outward heat flow through the boundary of the simulated region is accounted for by means of distributed thermal resistances. To provide such boundary conditions, but also as an independent design tool, a novel analytical thermal resistance model for multigate power MESFETs is introduced. Results from both models are discussed and compared with measurements.<>
Keywords :
III-V semiconductors; Schottky gate field effect transistors; gallium arsenide; power transistors; semiconductor device models; DC models; GaAs; MESFETs; active region; analytical thermal resistance model; design tool; distributed thermal resistances; high-resolution coupled electrothermal two-dimensional simulation; large-scale outward heat flow; multigate power MESFETs; simulated region; small-signal self-consistent thermal physical model; Analytical models; Electric resistance; Gallium arsenide; Heat sinks; MESFETs; Resistance heating; Spatial resolution; Temperature; Thermal conductivity; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1989. IEDM '89. Technical Digest., International
Conference_Location :
Washington, DC, USA
ISSN :
0163-1918
Print_ISBN :
0-7803-0817-4
Type :
conf
DOI :
10.1109/IEDM.1989.74248
Filename :
74248
Link To Document :
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