An automated flip-chip assembly technology for advanced VLSI packaging

Author

Bartschat, Michael K.

Author_Institution

AT&T Bell Lab., Murray Hill, NJ, USA

fYear

1988

fDate

9-11 May 1988

Firstpage

335

Lastpage

341

Abstract

Advanced VLSI packaging (AVP) provides high-density interconnection for VLSI devices, which are flip-chip attached to a silicon substrate. An automated assembly technology has been developed to meet the high-placement-accuracy requirements of AVP. It used vision-guided robotic system to align solder-bumped ICs on a multichip silicon substrate and effect a thermocompression bond. A robotic work-cell that features 30-μm overall placement accuracy has been developed and implemented. Custom tooling, the design of the optical system, the summation of system errors, and the inherently accurate calibration techniques are discussed. The automated assembly technology has been successfully applied to AT&T´s first AVP design, namely, the WE 32100 chip set module

Keywords

VLSI; electronic engineering computing; flip-chip devices; industrial robots; integrated circuit technology; microassembling; 30 micron; AVP design; WE 32100 chip set module; advanced VLSI packaging; automated flip-chip assembly technology; calibration techniques; custom tooling; high-density interconnection; multichip Si substrate; optical system; placement accuracy; robotic work-cell; solder bumped IC; vision-guided robotic system; Bonding; Calibration; Optical design; Optical design techniques; Packaging; Robot vision systems; Robotic assembly; Robotics and automation; Silicon; Very large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Components Conference, 1988., Proceedings of the 38th

Conference_Location

Los Angeles, CA

Type

conf

DOI

10.1109/ECC.1988.12614

Filename

12614