DocumentCode
2513244
Title
Improved triaxial set-ups for the measurement of complex transfer impedances and admittances of shielded multiconductor cables inside cable bundles
Author
Jung, Lorenz ; Ter Haseborg, Jan Luiken
Author_Institution
Dept. of Meas. Eng. & Electromagn. Compatibility, Tech. Univ. Hamburg-Harburg, Germany
Volume
1
fYear
2000
fDate
2000
Firstpage
41
Abstract
The determination of the complex transfer impedances and transfer admittances of shielded multiconductor cables is the prerequisite for calculating the disturbing currents on the inner wires of the cable. With a measurement procedure based on the triaxial measurement set-ups using multiconductor transmission line theory for evaluation, it is possible to determine individual transfer impedances and admittances for each inner conductor of a single shielded multiconductor cable over a broad frequency range. This paper shows a first attempt to measure transfer impedances of cables that are located in cable bundles with a modified measurement set-up that is based on the measurement set-up for single cables. As soon as some emerged problems, which are also apparent in a real world environment, have been solved, it should be possible to carry out precise transfer impedance and admittance measurements on cables that are located in cable bundles
Keywords
cable shielding; cable testing; electric admittance measurement; electric impedance measurement; electromagnetic shielding; multiconductor transmission lines; transmission line theory; EMI; cable bundles; complex transfer admittance measurement; complex transfer impedance measurement; disturbing currents; inner wires; measurement procedure; modified measurement set-up; multiconductor transmission line theory; shielded multiconductor cables; triaxial measurement set-ups; Admittance; Communication cables; Conductors; Electromagnetic measurements; Equivalent circuits; Impedance measurement; Multiconductor transmission lines; Transmission line measurements; Voltage; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility, 2000. IEEE International Symposium on
Conference_Location
Washington, DC
Print_ISBN
0-7803-5677-2
Type
conf
DOI
10.1109/ISEMC.2000.875534
Filename
875534
Link To Document