Title :
Experimental characterization of switching noise and signal integrity in deep submicron integrated circuits
Author_Institution :
Infineon Technolgies AG, Munich, Germany
Abstract :
The paper describes a strategy for characterization of on-chip EMC behaviour. The focus lies on electromagnetic emission (EMC), which is the most important part for microcontrollers with a 5 V supply. A reliable testchip strategy is presented. From the evaluation of those testchips, silicon circuits for EME reduction have been identified which were then implemented in microcontroller productive steps. An overview of valuable design measures is given as well as the system aspects of EMC on chiplevel and the next steps which have been started to support “chip design for EMC” before production. The benefit for application designers are pointed out
Keywords :
CMOS digital integrated circuits; electromagnetic compatibility; electromagnetic interference; integrated circuit design; integrated circuit noise; integrated circuit testing; microcontrollers; mixed analogue-digital integrated circuits; monolithic integrated circuits; 16 bit; 5 V; CMOS design; EMC; EME reduction; EMI; PCB; Si; chip design; deep submicron integrated circuits; design measures; electromagnetic emission; experiment; microcontrollers; mixed signal design; on-chip EMC; reliable testchip; signal integrity; silicon circuits; switching noise; Circuit testing; Clocks; Electromagnetic compatibility; Frequency domain analysis; Integrated circuit measurements; Microcontrollers; Potential energy; Radio frequency; Semiconductor device measurement; Silicon;
Conference_Titel :
Electromagnetic Compatibility, 2000. IEEE International Symposium on
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-5677-2
DOI :
10.1109/ISEMC.2000.875546
