Title :
Experimental evaluation of adhesive technologies for robotic grippers on micro-rough surfaces
Author :
Ruffatto, D. ; Beganovic, Dzenis ; Parness, Aaron ; Spenko, M.
Author_Institution :
Mech., Mater., & Aerosp. Dept., Illinois Inst. of Technol., Chicago, IL, USA
fDate :
May 31 2014-June 7 2014
Abstract :
This paper presents the performance of a newly developed adhesive that combines an electrostatic adhesive with a directional dry (gecko-like) adhesive. The focus is on the adhesive´s performance on micro-rough surfaces, which has a large number of applications in robotic mobility and manipulation such as climbing, perching, and grasping. Performance was characterized using shear/normal adhesion pressure limit curves and comparing the new hybrid adhesive to each individual adhesive mechanism and a control. Results show that the electrostatic directional dry adhesive generally performs better than a directional dry adhesive, but that on several surfaces, an electrostatic adhesive with no fibrillar mechanism performs the best. Additionally, the paper introduces a new mechanism that maintains an adhesive´s compliance on micro-rough surfaces while transmitting shear and normal forces to a rigid structure. The mechanism is experimentally compared to a rigid backing and a gecko-like hierarchical suspension layer. Results show that the mechanism performs the best when subjected to mainly normal loads, but a hierarchical suspension handles shear loads better.
Keywords :
adhesion; adhesives; grippers; manipulators; mobile robots; rough surfaces; adhesive technology; electrostatic adhesive; electrostatic directional dry adhesive; fibrillar mechanism; gecko-like adhesive; gecko-like hierarchical suspension layer; hybrid adhesive; manipulation; microrough surfaces; normal force; rigid backing; rigid structure; robotic grippers; robotic mobility; shear force; shear/normal adhesion pressure limit curves; Adhesives; Electrostatics; Force; Robots; Rough surfaces; Substrates; Surface roughness;
Conference_Titel :
Robotics and Automation (ICRA), 2014 IEEE International Conference on
Conference_Location :
Hong Kong
DOI :
10.1109/ICRA.2014.6907765