DocumentCode
2514183
Title
Modeling and characterization of wire bonding and tape automatic bonding. Analytical formulas and experimental validation
Author
Hassaine, N. ; Shen, Y. ; Ntake, P.
Author_Institution
Harris Farinon Canada Inc., Dollard-des-Ormeaux, Que., Canada
fYear
1998
fDate
9-12 Aug 1998
Firstpage
281
Lastpage
284
Abstract
A simplified method has been established to model and characterize two types of short interconnections: wire bonding and tape automatic bonding (TAB). A comparison between these two parasitic elements is presented and analytical formulas easy to use in CAD applications are proposed to calculate their inductance. These results are compared with measurements performed in the frequency range of (1-30) GHz
Keywords
MMIC; circuit CAD; hybrid integrated circuits; integrated circuit interconnections; integrated circuit modelling; lead bonding; tape automated bonding; 1 to 30 GHz; CAD applications; IC fabrication; MHMICs; MMICs; TAB; parasitic elements; short interconnections; taped automatic bonding; wire bonding; Bonding; Circuit simulation; Conductors; Electronic mail; Geometry; Inductance; Integrated circuit interconnections; Packaging; Voltage; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Radio and Wireless Conference, 1998. RAWCON 98. 1998 IEEE
Conference_Location
Colorado Springs, CO
Print_ISBN
0-7803-4988-1
Type
conf
DOI
10.1109/RAWCON.1998.709191
Filename
709191
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