Title :
Modeling and characterization of wire bonding and tape automatic bonding. Analytical formulas and experimental validation
Author :
Hassaine, N. ; Shen, Y. ; Ntake, P.
Author_Institution :
Harris Farinon Canada Inc., Dollard-des-Ormeaux, Que., Canada
Abstract :
A simplified method has been established to model and characterize two types of short interconnections: wire bonding and tape automatic bonding (TAB). A comparison between these two parasitic elements is presented and analytical formulas easy to use in CAD applications are proposed to calculate their inductance. These results are compared with measurements performed in the frequency range of (1-30) GHz
Keywords :
MMIC; circuit CAD; hybrid integrated circuits; integrated circuit interconnections; integrated circuit modelling; lead bonding; tape automated bonding; 1 to 30 GHz; CAD applications; IC fabrication; MHMICs; MMICs; TAB; parasitic elements; short interconnections; taped automatic bonding; wire bonding; Bonding; Circuit simulation; Conductors; Electronic mail; Geometry; Inductance; Integrated circuit interconnections; Packaging; Voltage; Wire;
Conference_Titel :
Radio and Wireless Conference, 1998. RAWCON 98. 1998 IEEE
Conference_Location :
Colorado Springs, CO
Print_ISBN :
0-7803-4988-1
DOI :
10.1109/RAWCON.1998.709191
