Ground bouncing in PCB with integrated circuits

Author

Kobidze, G. ; Nishizawa, A. ; Tanabe, S.

Author_Institution

Adv. Technol. R&D Center, Mitsubishi Electr. Corp., Hyogo, Japan

Volume

1

fYear

2000

fDate

2000

Firstpage

349

Abstract

A newly developed FDTD-SPICE hybrid simulation tool has been applied to the problem of ground bouncing. A simple example, that can be experimentally verified, was considered and modeled. A 30 MHz pulse train coming at the input of a buffer IC caused disturbances in the power line of the PCB. The modeling allows a designer to estimate precisely the bouncing adverse consequences and to anticipate the effect for countermeasures. Experimental results validate the computations. The analysis tool and methodology may be applied to very complicated PCB and circuits with many ICs

Keywords

SPICE; circuit simulation; electromagnetic interference; equivalent circuits; finite difference time-domain analysis; hybrid simulation; printed circuit design; FDTD-SPICE hybrid simulation tool; PCB; buffer IC; countermeasures; disturbances; ground bouncing; integrated circuits; power line; pulse train; Analog integrated circuits; Analytical models; Circuit simulation; Equivalent circuits; Finite difference methods; Hybrid integrated circuits; Magnetic analysis; SPICE; Time domain analysis; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 2000. IEEE International Symposium on

Conference_Location

Washington, DC

Print_ISBN

0-7803-5677-2

Type

conf

DOI

10.1109/ISEMC.2000.875591

Filename

875591