DocumentCode
2514851
Title
Designed experiments to analyze the solder joint quality output of a SMD remanufacturing system
Author
Fidan, Ismail ; Kraft, Russell P. ; Ruff, Lawrence E. ; Derby, Stephen J.
Author_Institution
Center for Integrated Electron., Rensselaer Polytech. Inst., Troy, NY, USA
fYear
1996
fDate
14-16 Oct 1996
Firstpage
422
Lastpage
429
Abstract
A robotic remanufacturing cell system developed at Rensselaer is used to replace a surface mounted component on a populated Printed Circuit Board (PCB). The performance goal is to estimate the high quality solder joint output to measure the cell system´s throughput. Maximizing the number of the reliably reworked components by the cell system is not chosen as a goal for measuring the system´s performance. This is because rework is a low volume process and the cell being used is an experimental prototype system. The purpose of this paper is to present the steps, factors, and levels for obtaining a good solder joint with the rework cell developed here
Keywords
design of experiments; printed circuit manufacture; quality control; soldering; surface mount technology; Rensselaer; SMD; designed experiments; printed circuit board; rework; robotic remanufacturing cell; solder joint quality; surface mounted component; Assembly systems; Cleaning; Design methodology; Fiber lasers; Laser beams; Power lasers; Printed circuits; Quantum cascade lasers; Robotic assembly; Soldering;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Symposium, 1996., Nineteenth IEEE/CPMT
Conference_Location
Austin, TX
ISSN
1089-8190
Print_ISBN
0-7803-3642-9
Type
conf
DOI
10.1109/IEMT.1996.559780
Filename
559780
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