• DocumentCode
    2514942
  • Title

    Near field probe for detecting resonances in EMC application

  • Author

    Xiao, Jiang ; Liu, Dazhao ; Pommerenke, David ; Huang, Wei ; Shao, Peng ; Li, Xiang ; Min, Jin ; Muchaidze, Giorgi

  • Author_Institution
    EMC Lab., Missouri Univ. of Sci. & Technol., Rolla, MO, USA
  • fYear
    2010
  • fDate
    12-16 April 2010
  • Firstpage
    243
  • Lastpage
    246
  • Abstract
    Resonances degrade the product´s EMI or immunity performance at resonance frequencies. Near field scanning techniques, like EMI scanning or susceptibility scanning determine the local behaviour, but fail to connect the local behaviour to the system level behaviour. Resonating structures form part of the coupling paths, i.e., identifying them will aid in understanding system level behaviour of products. In this article, a near field probe (patent pending) is proposed to detecting the resonances frequencies, locations or resonating structures and their Q-factors. The probe is suitable for integration into an automatic scanning system for analysing resonances of PCBs, cables, structural elements etc. The mechanism of the probe has been verified with full wave tools (CST MWS and Ansoft HFSS). Two samples of application are presented.
  • Keywords
    Q-factor; circuit resonance; electromagnetic compatibility; electromagnetic coupling; electromagnetic interference; probes; Ansoft HFSS; CST MWS; EMC application; EMI susceptibility scanning; Q-factors; automatic scanning system; coupling paths; detecting resonances; full wave tools; immunity performance; near field probe; near field scanning techniques; resonance frequency; resonating structures; Antenna measurements; Coaxial cables; Electromagnetic compatibility; Electromagnetic interference; Geometry; Magnetic field measurement; Magnetic resonance; Magnetic shielding; Probes; Resonant frequency;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-5621-5
  • Type

    conf

  • DOI
    10.1109/APEMC.2010.5475739
  • Filename
    5475739