DocumentCode
2515868
Title
Multi-Energy, Fast Counting Hybrid CZT Pixel Detector with Dedicated Readout Integrated Circuit
Author
Clajus, Martin ; Cajipe, Victoria B. ; Hayakawa, Satoshi ; Tümer, Tümay O. ; Willson, Paul D.
Author_Institution
NOVA R & D, Inc., Riverside, CA
Volume
6
fYear
2006
fDate
Oct. 29 2006-Nov. 1 2006
Firstpage
3602
Lastpage
3606
Abstract
A new mixed signal front-end readout electronics integrated circuit (IC) called HILDA (Hyperspectral Imaging with Large Detector Arrays) has been developed for two-dimensional CdZnTe (CZT) pixel detector arrays. The CZT array is directly bonded on top of the IC. The CZT array and the HILDA-IC have matching geometric pixel/channel structure and dimensions, a 16times16 array of 0.5 mm times 0.5 mm pitch. They are mounted together using flip-chip bump bonding. The pixel detector and readout IC are designed for high-rate photon counting independently for each channel/pixel and multiple-energy binning up to eight energy bands. Therefore, eight images can be produced that represent identical slices in time and space but different energy bands. Several HILDA CZT pixel detector hybrids have been fabricated and tested. The CZT pixel detector, the readout IC and preliminary test results are presented in this paper. The main potential applications envisioned for this chip are industrial non-destructive inspection, security applications and CT scanners.
Keywords
III-V semiconductors; cadmium compounds; computerised tomography; nondestructive testing; photon counting; readout electronics; semiconductor counters; 2D CdZnTe pixel detector array; CT scanner; CdZnTe; HILDA; Hyperspectral Imaging with Large Detector Arrays; fast counting hybrid CZT pixel detector; flip-chip bump bonding; front-end readout electronics; high-rate photon counting; industrial nondestructive inspection; multiple-energy binning; readout integrated circuit; security application; Bonding; Detectors; Hybrid integrated circuits; Hyperspectral imaging; Inspection; Integrated circuit testing; Photonic integrated circuits; Pixel; Readout electronics; Sensor arrays;
fLanguage
English
Publisher
ieee
Conference_Titel
Nuclear Science Symposium Conference Record, 2006. IEEE
Conference_Location
San Diego, CA
ISSN
1095-7863
Print_ISBN
1-4244-0560-2
Electronic_ISBN
1095-7863
Type
conf
DOI
10.1109/NSSMIC.2006.353777
Filename
4179819
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