DocumentCode :
2515877
Title :
A UHF-band miniaturized LTCC band-pass filter with high performance
Author :
Dai, Yong-sheng ; Guo, Yu-Hong ; Tang, Xiong-Xin ; Hu, Yuan-Yun ; Xie, Wen-Ming ; Wei Huang ; Xiao, Sheng-Lei ; Zhang, Jie ; Fu, Guang-Qiang ; Zhou, Wen-Kan ; Yao, You-Fang ; Chen, Shao-Bo ; Wang, Li-Jie
Author_Institution :
Nanjing Univ. of Sci. & Technol., Nanjing, China
fYear :
2010
fDate :
12-16 April 2010
Firstpage :
1366
Lastpage :
1369
Abstract :
This letter outlines the design and manufacture of a UHF-band miniaturized band-pass filter realized by low-temperature cofired ceramic (LTCC) technology for super heterodyne microwave receiver applications. A distinct feature of this filter is the smaller size than conventional filter at such a low frequency and steady pass-band temperature electrical performance compared with surface acoustic wave filter. The band-pass filter with a central frequency of 750 MHz and a 40 MHz pass-band is designed as a three-dimensional (3-D) structure based on distributed components. This filter has excellent out-of-band attenuation performance and it has 50.1 dB and 56.8 dB of attenuation at 550 MHz and 950 MHz respectively. The measured insertion loss is less than 2.7 dB at 750 MHz, and the input/output VSWR is less than 2.0. The overall size of the miniaturized filter is only 4.5 mm × 3.2 mm × 1.5 mm.
Keywords :
UHF filters; band-pass filters; microwave receivers; superheterodyne receivers; 3D structure; LTCC technology; UHF-band miniaturized LTCC band-pass filter; frequency 40 MHz; frequency 550 MHz; frequency 750 MHz; frequency 950 MHz; insertion loss; low-temperature cofired ceramic technology; out-of-band attenuation; steady pass-band temperature electrical performance; superheterodyne microwave receiver; surface acoustic wave filter; three-dimensional structure; Acoustic waves; Attenuation; Band pass filters; Ceramics; Frequency; Manufacturing; Microwave filters; Microwave technology; Surface acoustic waves; Temperature; Bandpass Filter; High Stopband Rejection; LTCC; Miniaturization;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-5621-5
Type :
conf
DOI :
10.1109/APEMC.2010.5475793
Filename :
5475793
Link To Document :
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