Title :
Finite element analysis for solder ball failures in chip scale package
Author :
Lee, Taekoo ; Lee, Jinhyuk ; Jung, Ilgyu
Author_Institution :
Packaging Technol. Team, Samsung Electron. Co. Ltd., South Korea
Abstract :
In this study, the failure mechanism of solder ball connect in chip scale packaging (CSP) utilizing wire-bonded ball grid array was elucidated using finite element analysis. The macro-micro-coupling technique was used in the current model. There exist two contributors to solder ball cracking: shear stress and warpage of the package. It was recognized that shear stress prevailed over warpage of the package in impact on solder ball cracking in the present type of CSP
Keywords :
cracks; deformation; failure analysis; finite element analysis; integrated circuit packaging; integrated circuit reliability; soldering; stress-strain relations; thermal expansion; thermal stress cracking; thermal stresses; CSP; FEM; ball grid array; chip scale package; failure mechanism; finite element analysis; macro-micro-coupling technique; model; package warpage; shear stress; solder ball connect; solder ball cracking; solder ball failures; wire-bonded BGA package; Chip scale packaging; Compressive stress; Costs; Electronic packaging thermal management; Electronics packaging; Failure analysis; Fatigue; Finite element methods; Tensile stress; Thermal stresses;
Conference_Titel :
Physical & Failure Analysis of Integrated Circuits, 1997., Proceedings of the 1997 6th International Symposium on
Print_ISBN :
0-7803-3985-1
DOI :
10.1109/IPFA.1997.638070
