Title :
Observation of space charge distribution up to electric breakdown in acetophenone-coated polyethylene film
Author :
Mitsumoto, Spnichi ; Nagao, Masayuki ; Kosaki, Masamitsu
Author_Institution :
Dept. of Electr. & Electron. Eng., Toyohashi Univ. of Technol., Japan
Abstract :
This paper describes the effects of polarity of applied voltage and electrode metal on electric conduction and space charge formation up to electric breakdown in one-sidedly acetophenone-coated low-density polyethylene (LDPE) film. Up to the electric field of about 0.5 MV/cm with Au electrode, the acetophenone-coated positive electrode gives much larger conduction current than the negative one, suggesting that the existence of acetophenone at electrode interface enhances the hole injection rather than the electron injection. In the case of Al electrode this polarity dependence is opposite, suggesting the electron injection is more enhanced for Al electrode. Above about 0.5 MV/cm, however, these polarity effects changed oppositely. This change of polarity effect in high field region is explained by considering the space charge distribution and carrier injection from the acetophenone non-coated-side electrode. With the polarity where the current above 0.5 MV/cm became much larger, the dc electric strength showed significant decrease, showing that the dc breakdown is governed by the thermal process caused by Joule heating
Keywords :
electric breakdown; electric strength; electrical conductivity; polyethylene insulation; polymer films; space charge; DC electric strength; Joule heating; LDPE; acetophenone coated polyethylene film; electric breakdown; electric conduction; electrode interface; electron injection; hole injection; space charge distribution; thermal process; voltage polarity; Breakdown voltage; Charge carrier processes; Conductive films; Electric breakdown; Electrodes; Electrons; Gold; Plastic films; Polyethylene; Space charge;
Conference_Titel :
Conduction and Breakdown in Solid Dielectrics, 1998. ICSD '98. Proceedings of the 1998 IEEE 6th International Conference on
Conference_Location :
Vasteras
Print_ISBN :
0-7803-4237-2
DOI :
10.1109/ICSD.1998.709225