DocumentCode
2517429
Title
Crosstalk and Switching Noise Mechanism Study in High Density Wire-bond FPGA Device
Author
Tan, Siow Chek ; Yew, Yee Huan ; Shi, Hong
Author_Institution
Altera Corp. (M) Sdn Bhd, Bayan Lepas, Malaysia
fYear
2008
fDate
9-12 Dec. 2008
Firstpage
78
Lastpage
83
Abstract
This paper presents the dominant contributors of mutual inductance in wire-bond package thru study on the return path. The study is validated through real device measurement correlation. Based on the study, techniques to reduce crosstalk in wire-bond package will be presented which will be beneficial to the packaging world as bond wire continues to be the dominant technique to connect die to the package in low cost application.
Keywords
ball grid arrays; circuit noise; crosstalk; field programmable gate arrays; BGA package; crosstalk; die-package connection; grid array package; high density wire-bond FPGA device; mutual coupling; mutual inductance; return path; switching noise mechanism; Bonding; Costs; Crosstalk; Field programmable gate arrays; Fingers; Impedance; Inductance; Packaging; Voltage; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
Conference_Location
Singapore
Print_ISBN
978-1-4244-2117-6
Electronic_ISBN
978-1-4244-2118-3
Type
conf
DOI
10.1109/EPTC.2008.4763415
Filename
4763415
Link To Document