Title :
First-principles Investigation of the Structural and Electronic Properties of Cu Based Intermetallics
Author :
Chatterjee, Abhijit
Author_Institution :
Accelrys Mater. Sci., Tokyo
Abstract :
Cu6Sn5 is an important intermetallic compound (IMC), which was known to improve greatly the reliability of the solder joints in integrated circuits. The first-principles calculation were performed to determine the stable structure of Cu(6-x) NixSn5 IMC. The structural and electronic properties of Cu(6-x)NixSn5 IMCs have been calculated. The results of energy calculation and density of states demonstrate that this Cu4Ni2Sn5 IMC had a more stable structure than Cu6Sn5. The mechanical stability of the systems was studied to compare the compressibility of the matrices. A priori rule is formulated to correlate the stability and composition of the said intermetallics.
Keywords :
ab initio calculations; copper alloys; crystal structure; electronic density of states; integrated circuit packaging; integrated circuit reliability; mechanical stability; nickel alloys; tin alloys; Cu6-xNixSn; density of states; electronic properties; first-principles calculations; intermetallic compound; mechanical stability; structural properties; Bonding; Electronics industry; Intermetallic; Materials science and technology; Microstructure; Monitoring; Soldering; Solid state circuits; Stability; Temperature;
Conference_Titel :
Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2117-6
Electronic_ISBN :
978-1-4244-2118-3
DOI :
10.1109/EPTC.2008.4763423
