DocumentCode
2517611
Title
Full-wave investigation on the curved bonding wire interconnection by using a suitable FDTD code
Author
Alimenti, F. ; Mezzanotte, P. ; Roselli, L.
Author_Institution
Ist. di Elettronica, Perugia Univ., Italy
Volume
3
fYear
1997
fDate
8-13 June 1997
Firstpage
1737
Abstract
The scattering parameters of the curved bonding wire interconnection, accounting for its curvature, have been computed by using a proper discretization technique along with the Finite Difference Time Domain (FDTD) method. The curvature has been modeled assuming a polygonal approximation. The obtained results have been compared against vector network analyzer measurements showing a satisfactory agreement. In order to investigate the curvature effect, the proposed approach has been compared with a rectangular approximation of the bonding wire demonstrating that this approximation provides a useful modeling of the interconnection.
Keywords
S-parameters; finite difference time-domain analysis; hybrid integrated circuits; integrated circuit interconnections; integrated circuit measurement; integrated circuit modelling; microstrip lines; microwave integrated circuits; microwave measurement; network analysers; FDTD code; curved bonding wire interconnection; discretization technique; full-wave investigation; hybrid ICs; interconnection modelling; microstrip bonding wire; polygonal approximation; rectangular approximation; scattering parameters; vector network analyzer measurements; Bonding; Equivalent circuits; Finite difference methods; Frequency; Impedance; Integrated circuit interconnections; Microstrip; Millimeter wave measurements; Time domain analysis; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1997., IEEE MTT-S International
Conference_Location
Denver, CO, USA
ISSN
0149-645X
Print_ISBN
0-7803-3814-6
Type
conf
DOI
10.1109/MWSYM.1997.596854
Filename
596854
Link To Document