Title :
Laser Assisted Solder Bump Mold Fabrication
Author :
Lim, Yong-Jin ; Jung, Seoung-Ho ; Park, Sang-il ; Choi, Jung-Su ; Choi, Eun-Youl ; Kim, Chung-Tae
Author_Institution :
ADP Eng. Co. Ltd., Seongnam, South Korea
Abstract :
Sold bump mold fabrication using Excimer laser (KrF, 248 nm) source for patterning method is presented. The mold is designed to make reflowed solder bump with diameter of 115 ¿m for 8 inch wafer. We have developed CrOx / Cr binary metal masks which allow for obtaining circular cavities with diameter of 160 ¿m, depth of 50 ¿m and pitch of 300 ¿m. We have obtained the characteristics of patterned etch mask with diameter of 60 ± 3 ¿m, pitch of 300± 2 ¿m by laser method. Cavities are performed with a dilute hydrofluoric acid (HF) solution, having the diameter of 160 ± 3 ¿m, depths of 50 ±1 ¿m. These results indicate that solder bump mold fabrication using laser method enables cavity formation with good uniformity.
Keywords :
chromium; chromium compounds; etching; laser beam applications; masks; moulding; soldering; solders; CrO-Cr; binary metal masks; circular cavities; depth 50 mum; dilute hydrofluoric acid solution; laser assisted solder bump mold fabrication; patterned etch mask; size 160 mum; Chromium; Cleaning; Glass; Hafnium; Lithography; Optical device fabrication; Sputter etching; Sputtering; Strips; Thermal expansion;
Conference_Titel :
Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2117-6
Electronic_ISBN :
978-1-4244-2118-3
DOI :
10.1109/EPTC.2008.4763431
