Thermal resistance analysis of high power light emitting diodes

Author

Guo, Weiling ; Ding, Tianping ; Cui, Bifeng ; Yin, Fei ; Cui, Desheng ; Yan, Weiwei

Author_Institution

Key Lab. of Opto-Electron. Technol., Beijing Univ. of Technol., Beijing, China

fYear

2010

fDate

3-6 Dec. 2010

Firstpage

1

Lastpage

4

Abstract

Thermal characteristic of light emitting diodes is one of primary reliability parameters. In this paper, the thermal resistances of different kinds of blue and white high power LEDs are measured by the forward voltage based method. The relationships between thermal resistance and heat time at measurement currents 1mA, 5mA and 10mA are obtained respectively. The results show that there is optimum heat balance time of 300~1200s to measure the thermal resistances at room temperature. The influence of current crowding, the phosphor and heat sink to the thermal resistance has been demonstrated.

Keywords

light emitting diodes; semiconductor device reliability; thermal resistance; blue high power LED; forward voltage based method; heat balance time; high power light emitting diodes; reliability; thermal resistance analysis; white high power LED; Current measurement; Light emitting diodes; Resistance heating; Temperature measurement; Thermal resistance; forward voltage; high power LED; thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Advances in Optoelectronics and Micro/Nano-Optics (AOM), 2010 OSA-IEEE-COS

Conference_Location

Guangzhou

Print_ISBN

978-1-4244-8393-8

Electronic_ISBN

978-1-4244-8392-1

Type

conf

DOI

10.1109/AOM.2010.5713511

Filename

5713511