Thermal Management Technologies for Electronic Packaging: Current Capabilities and Future Challenges for Modelling Tools

Extracting heat from electronic systems has always been a challenging task for electronic package designers. Ever increasing miniaturisation and functionality of Microsystems packaging technologies is resulting in increased power densities that current thermal management techniques are finding difficult to manage. Thermal management of electronics is a significant issue because of increasing volumetric power densities and the harsh environments in which they are deployed. Environmental factors are forcing companies to broaden their view of thermal management as energy management, where industry is being driven to minimise the amount of energy required to keep electronic systems cool. This paper will discuss both current capabilities and future requirements for passive and active cooling technologies. Modelling technologies which can be used by designers to predict optimal thermal/energy management solutions will also be discussed.