DocumentCode :
2518784
Title :
Optimization of the Thermal Performance of Microchannel Heat Sinks Using Thermally Developing Nusselt Number Correlation
Author :
Lee, P.S. ; Chou, S.K. ; Lee, Y.J.
Author_Institution :
Dept. of Mech. Eng., Nat. Univ. of Singapore, Singapore, Singapore
fYear :
2008
fDate :
9-12 Dec. 2008
Firstpage :
545
Lastpage :
551
Abstract :
One-dimensional (1-D) thermal resistance model has been shown in various works to be a computationally economical alternative to the full three-dimensional (3-D) conjugate heat transfer analysis achievable by computational fluid dynamics (CFD) codes for evaluating the thermal performance of microchannel heat sinks. This simplified 1-D approach is often exploited to obtain the optimum microchannel geometry that would give rise to the best thermal performance under certain constraint such as constant flow rate, pressure drop or pumping power. The thermal resistance model essentially consists of the following three thermal resistive components: conductive, convective and caloric. In evaluating the convective thermal resistance, fully developed Nusselt number correlations were often used. However, the small length scale of microchannels and the fact that liquid coolant with high Prandtl number is often used as the working fluid means that the flow encountered in microchannel heat sinks is typically thermally developing rather than fully developed. The present work utilizes a recently proposed Nusselt number correlation that was specifically developed for rectangular channels of various aspect ratios to evaluate the convective thermal resistance. Comparison shows that the optimized microchannel geometry obtained using the more appropriate thermally developing Nusselt number correlation is different from that obtained using a fully developed Nusselt number correlation. In fact, the discrepancy in the channel width can be as large as 30% for the range of constant pressure drop constraint examined.
Keywords :
computational fluid dynamics; convection; heat sinks; microchannel flow; optimisation; thermal resistance; 1D model; CFD codes; Nusselt number correlation; Prandtl number; aspect ratio; caloric thermal resistance; computational fluid dynamics; conductive thermal resistance; constant flow rate; convective thermal resistance; heat transfer analysis; liquid coolant; microchannel geometry; microchannel heat sink; one-dimensional thermal resistance model; optimization; pressure drop; rectangular channel; Computational fluid dynamics; Geometry; Heat sinks; Heat transfer; Microchannel; Performance analysis; Power generation economics; Resistance heating; Thermal conductivity; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2117-6
Electronic_ISBN :
978-1-4244-2118-3
Type :
conf
DOI :
10.1109/EPTC.2008.4763490
Filename :
4763490
Link To Document :
بازگشت