Title :
Movable micromechanical joints for use in micromechatronics
Author :
Dötzel, W. ; Schröter, B. ; Frühauf, J. ; Mehner, J. ; Gessner, T.
Author_Institution :
Fac. of Electr. Eng. & Inf. Technol., Chemnitz Univ. of Technol., Germany
Abstract :
This paper deals with single-crystal silicon as a structural material. Its material properties are compared to those of other materials conventionally used for mechanical applications. The advantages; of silicon, e.g. no creep fatigue, are depicted and the most popular micromechanical techniques are named and explained. It is shown how compliant structures made from single-crystal silicon structured by wet chemical etching can be used for applications like flexible guides which allow deflections within the millimetre-range (scaling up). On the other hand, conventional principles of operation know from precision engineering can be shrunken to micromechanical dimensions. As an example, a step-by-step switchgear made by using the Silicon-On-Insulator (SOI) technology is presented.
Keywords :
bending; etching; microactuators; microswitches; silicon; silicon-on-insulator; MEMS; SOI technology; Si; compliant structures; material properties; micromechanical techniques; micromechatronics; movable micromechanical joints; single-crystal Si; step-by-step switchgear; structural material; wet chemical etching; Chemical technology; Crystalline materials; Fatigue; Manufacturing; Mechanical factors; Micromechanical devices; Semiconductor materials; Silicon; Springs; Wet etching;
Conference_Titel :
Electronic Instrument Engineering Proceedings, 2002. APEIE 2002. 2002 6th International Conference on Actual Problems of
Print_ISBN :
0-7803-7361-8
DOI :
10.1109/APEIE.2002.1075774
