DocumentCode :
2518929
Title :
Fluxless Flip-Chip Bonding Process Using Hydrogen Radical
Author :
Hagihara, Taizo ; Takeuchi, Tatsuya ; Ohno, Yasuhide
Author_Institution :
Shinko Seiki Co., Ltd., Kobe, Japan
fYear :
2008
fDate :
9-12 Dec. 2008
Firstpage :
595
Lastpage :
600
Abstract :
Recently the portable electronic appliances have been remarkably minimized- (in weight and thickness), the assembled electric parts have also been gotten smaller and 3- dimensional and Flip-Chip bonding with solder bump haven been widely used. The 3-dimensional mounting has been put into an actual application stage. One of the important technologies for supporting these packaging is a bonding technology. Especially the reliability in Flip-Chip bonding technology of the fine solder bump has been an important key. In the fine solder, the bump-to-bump pitch gets smaller, and the conventionally applied flux has a more difficulty in cleaning after the reflow. This problem is required establishment of a fluxless reflow technology. Recently due to environmental problems, regulations for non-application of Halogen element have been established. And the flux has also been studied for Halogen-free application. From this viewpoint, the fluxless solder bonding technology has become an important factor. As the fluxless soldering technology, up to now, the author group has made studies for development of fluxless reflow process of solder bump, while taking note of reduction capability of hydrogen radical[1][3]. In this reports, we arrange the results of fluxless reflow and bonding. And we developed a high productive method of fluxless solid state bonding in the air using the solder bump, which the oxide film reduced by hydrogen radical irradiation before bonding. These results propose a new effect that hydrogen radical irradiation is not only reduce the oxide film but also inhibit re-oxide. And we think of this effect as a decoration such as chemical adsorption on the solder surfaces by hydrogen. And we call this effect as "Surface Hydrogen Buffering Effect".
Keywords :
adsorption; bonding processes; flip-chip devices; free radical reactions; free radicals; hydrogen; soldering; solders; H2; chemical adsorption; flip-chip bonding; fluxless solid state bonding; hydrogen radical irradiation; solder bump; surface hydrogen buffering effect; Assembly; Bonding processes; Chemicals; Cleaning; Environmental factors; Home appliances; Hydrogen; Packaging; Soldering; Solid state circuits;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2117-6
Electronic_ISBN :
978-1-4244-2118-3
Type :
conf
DOI :
10.1109/EPTC.2008.4763498
Filename :
4763498
Link To Document :
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