DocumentCode :
2519293
Title :
Experimental Study on the Use of PCM-based Heat Sink for Cooling of Mobile Devices
Author :
Wong, H.E. ; Tan, F.L. ; Fok, S.C.
Author_Institution :
Sch. of Mech. & Aerosp. Eng., Nanyang Technol. Univ., Singapore, Singapore
fYear :
2008
fDate :
9-12 Dec. 2008
Firstpage :
743
Lastpage :
748
Abstract :
An experimental study is conducted on the cooling of portable electronic devices using PCM-based heat sinks. The design uses different aluminum heat sinks filled with n-eicosane to store and dissipate the generated heat. The temperature profiles at three different power levels, (i.e. 3 W, 4 W and 5 W) for three different positions (i.e. horizontally, vertically and inclined at 45° to the horizontal) are measured. In addition, the surface temperature of each setup is captured with a thermal imager. The experimental results indicate that the PCM-based heat sinks can be used to effectively manage the temperature of portable electronic devices. Based on this finding, mathematical models are currently being developed to facilitate the optimal designs of PCM-based heat sinks.
Keywords :
cooling; heat sinks; phase change materials; PCM-based heat sink; aluminum heat sinks; cooling; mobile devices; n-eicosane; portable electronic devices; power 3 W; power 4 W; power 5 W; power levels; surface temperature; temperature profiles; thermal imager; Electronic components; Electronic packaging thermal management; Electronics cooling; Heat sinks; Mobile handsets; Personal digital assistants; Phase change materials; Temperature; Thermal management; Thermal management of electronics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2117-6
Electronic_ISBN :
978-1-4244-2118-3
Type :
conf
DOI :
10.1109/EPTC.2008.4763521
Filename :
4763521
Link To Document :
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