DocumentCode
2519380
Title
The Materials Science of Ballbonding: A Brief Overview
Author
Breach, C.D. ; Wulff, F.W.
Author_Institution
Oerlikon Esec Assembly Equip. Pte Ltd., Singapore
fYear
2008
fDate
9-12 Dec. 2008
Firstpage
778
Lastpage
788
Abstract
Thermosonic ballbonding is a metallurgical process that until recently was rarely the subject of metallurgical analysis. However, in recent years greater focus has been given to the materials science of thermosonic ball - wedge bonding in an attempt to better control and advance its application as an interconnect technology in advanced packages. This article briefly reviews the currently incomplete understanding of the underlying materials science of ballbonding and offers different viewpoints on some aspects of commonly studied phenomena, especially intermetallic growth.
Keywords
interconnections; tape automated bonding; advanced packages; interconnect technology; intermetallic growth; metallurgical process; thermosonic ballbonding; Assembly; Bonding; Friction; Intermetallic; Materials science and technology; Microscopy; Packaging; Temperature; Welding; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
Conference_Location
Singapore
Print_ISBN
978-1-4244-2117-6
Electronic_ISBN
978-1-4244-2118-3
Type
conf
DOI
10.1109/EPTC.2008.4763527
Filename
4763527
Link To Document