• DocumentCode
    2519380
  • Title

    The Materials Science of Ballbonding: A Brief Overview

  • Author

    Breach, C.D. ; Wulff, F.W.

  • Author_Institution
    Oerlikon Esec Assembly Equip. Pte Ltd., Singapore
  • fYear
    2008
  • fDate
    9-12 Dec. 2008
  • Firstpage
    778
  • Lastpage
    788
  • Abstract
    Thermosonic ballbonding is a metallurgical process that until recently was rarely the subject of metallurgical analysis. However, in recent years greater focus has been given to the materials science of thermosonic ball - wedge bonding in an attempt to better control and advance its application as an interconnect technology in advanced packages. This article briefly reviews the currently incomplete understanding of the underlying materials science of ballbonding and offers different viewpoints on some aspects of commonly studied phenomena, especially intermetallic growth.
  • Keywords
    interconnections; tape automated bonding; advanced packages; interconnect technology; intermetallic growth; metallurgical process; thermosonic ballbonding; Assembly; Bonding; Friction; Intermetallic; Materials science and technology; Microscopy; Packaging; Temperature; Welding; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-2117-6
  • Electronic_ISBN
    978-1-4244-2118-3
  • Type

    conf

  • DOI
    10.1109/EPTC.2008.4763527
  • Filename
    4763527