Title :
The Materials Science of Ballbonding: A Brief Overview
Author :
Breach, C.D. ; Wulff, F.W.
Author_Institution :
Oerlikon Esec Assembly Equip. Pte Ltd., Singapore
Abstract :
Thermosonic ballbonding is a metallurgical process that until recently was rarely the subject of metallurgical analysis. However, in recent years greater focus has been given to the materials science of thermosonic ball - wedge bonding in an attempt to better control and advance its application as an interconnect technology in advanced packages. This article briefly reviews the currently incomplete understanding of the underlying materials science of ballbonding and offers different viewpoints on some aspects of commonly studied phenomena, especially intermetallic growth.
Keywords :
interconnections; tape automated bonding; advanced packages; interconnect technology; intermetallic growth; metallurgical process; thermosonic ballbonding; Assembly; Bonding; Friction; Intermetallic; Materials science and technology; Microscopy; Packaging; Temperature; Welding; Wire;
Conference_Titel :
Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2117-6
Electronic_ISBN :
978-1-4244-2118-3
DOI :
10.1109/EPTC.2008.4763527